Chemical Mechanical Planarization is a procedure which involves the smoothing of the surfaces using a combination of chemical and mechanical forces. This procedure is applied in the manufacture of semiconductor devices in the semiconductor industry. With Microchip manufacturing being a very complex and highly delicate procedure, silicon wafers must be perfectly flat and smooth. For this process CMP slurries are used together with pads to smooth the surface of these wafers. These slurries are highly engineered chemical formulations. Fundamentally CMP slurries contain an abrasive material, such as silica or alumina and another chemical like hydrogen peroxide (H202).
With our ultrasonic measurement technology it is achievable to determine the concentration of H202 or density after dilution or importing CMP slurry, inline and real time with virtually no periodical cleaning needed. The 9670 series measures the sound velocity by making use of ultrasonic waves, which are generated in Rhosonics sensors. This technique makes it possible to measure the H202 concentration. Get in touch with Rhosonics to see what we can do for you.
Using our unique hybrid ultrasonic sensor technology, the 9600 Inline Slurry Analysers measure key process variables, such as suspended solids, dissolved solids, or density or even all 4 together.